SiC Wafer Grinding
Grinding; Lapping (1 or 2 steps) Polish and ChemicalMechanical Polishing (CMP) Silicon Carbide Wafer Grinding. The EVG250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps. The machine can be customized to your needs: Auto .